Rubicon has distinguished itself as an industry leader in the production of sapphire substrates and components. Our state-of-the-art facilities house multiple core drilling, grinding, ID and OD slicing and lapping machines. Wire saws complete the final step of slicing the sapphire into substrates with high quality surfaces and low bow and warp.

 

Rubicon is capable of processing C, A, M, and R plane material with tight geometric tolerances. Our capabilities support both large and small shapes and dimensions. Capabilities include:

 

 

      Core Drilling

 

      Slicing

             • Wire saws
             • O.D.and I.D. saws

 

      Grinding/Lapping

             • Double side grinding and lapping

             • O.D. and I.D. grinding

             • Edge grinding

 

      Polishing

 

      Crystal orientation

             • Laue spectrometer

             • High-precision x-ray goniometers

 

      Annealing in various atmospheres including vacuum

 

      Ultrasonic and chemical cleaning/rinsing